{"id":50639,"date":"2023-09-08T13:00:00","date_gmt":"2023-09-08T13:00:00","guid":{"rendered":"https:\/\/one.sightlinemg.com\/defensenews\/uncategorized\/2023\/09\/08\/how-darpa-is-tackling-long-term-microelectronics-challenges\/"},"modified":"2026-08-08T18:40:21","modified_gmt":"2026-08-08T18:40:21","slug":"how-darpa-is-tackling-long-term-microelectronics-challenges","status":"publish","type":"post","link":"https:\/\/one.sightlinemg.com\/defensenews\/pentagon\/2023\/09\/08\/how-darpa-is-tackling-long-term-microelectronics-challenges\/","title":{"rendered":"How DARPA is tackling long-term microelectronics challenges"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\">SEATTLE \u2014 Years before U.S. consumers felt the impact of semiconductor supply chain shortages, the Defense Advanced Research Projects Agency was already mulling how to tackle the long-term technological barriers facing commercial industry and the national security community.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In the last 30 years, the U.S. has gone from producing 37% of the global microchip supply to around 12%. Today, Taiwan produces most of the world\u2019s supply of advanced semiconductors and China exports a large portion of its microchips to the United States. These chips <a href=\"https:\/\/www.c4isrnet.com\/battlefield-tech\/2023\/08\/24\/us-research-interests-closely-tied-to-microelectronics-industrial-base\/\" target=\"_blank\">power everything from cell phones to cars<\/a> to the Pentagon\u2019s premier fifth-generation fighter aircraft, the F-35.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Concern around the resulting <a href=\"https:\/\/www.defensenews.com\/global\/asia-pacific\/2023\/01\/12\/how-bidens-microchip-ban-is-curbing-chinas-ai-weapons-efforts\/\" target=\"_blank\">U.S. dependency on overseas microelectronics supply chains<\/a> hit the mainstream during the COVID-19 pandemic when a microchip supply shortage caused car prices to skyrocket. But DARPA, the Pentagon\u2019s hub for high-risk, high-reward research and development, had been working to get ahead of the problem for years before that.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The agency\u2019s heritage in microelectronics research dates back decades and includes programs such as the Metal Oxide Silicon Implementation Service in the 1980s, which sought to quickly produce microelectronic devices. More recently, and following the release of a 2017 report from the President\u2019s Council of Advisors on Science and Technology that highlighted how technological limits were impeding U.S. semiconductor innovation, DARPA began formulating a plan to help push against some of those limits.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u201cBefore the urgency of the discussion was happening, we had people who really recognized that it was a pretty urgent problem,\u201d DARPA Director Stefanie Tompkins told C4ISRNET in an Aug. 22 interview.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">It\u2019s not unusual for DARPA to show up early to a problem set \u2014 in fact, that\u2019s part of the agency\u2019s mission. Mark Rosker, director of DARPA\u2019s Microsystems Technology Office, said the agency was designed to protect the Defense Department from technological surprise, which means it\u2019s often looking 10 to 15 years into the future to anticipate what challenges the national security community will be facing at that time.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u201cInherently what that does is it puts us in a position where we\u2019re looking for technologies that are going to be disruptive, that will cause change that\u2019s not anticipated,\u201d he said in an Aug. 23 interview. \u201cI think that often puts us in a position, typically, of higher risk and often \u2014 not always, but often \u2014 longer timescale.\u201d<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Where DARPA fits<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The agency in 2017 established a sweeping research effort called the Electronics Resurgence Initiative, or ERI, announcing it would<a href=\"https:\/\/www.c4isrnet.com\/battlefield-tech\/2022\/04\/27\/darpa-budget-request-seeks-to-bolster-critical-defense-technologies\/\" target=\"_blank\"> invest more than $1.5 billion over a five-year period<\/a> in a slate of programs designed to get after the key technological barriers facing commercial industry and national security agencies as they sought to advance microelectronics research and development and manufacturing.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Last year, DARPA reupped its commitment to forward-leaning microelectronics research, <a href=\"https:\/\/www.darpa.mil\/work-with-us\/electronics-resurgence-initiative\" target=\"_blank\">launching ERI 2.0 <\/a>with an emphasis on cutting-edge manufacturing opportunities as well as technologies that can help electronic systems operate in extreme environments. DARPA plans to spend another $3 billion on these efforts over the next five years.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Today, as federal agencies like the Department of Commerce and Department of Energy, look to reinvigorate the microelectronics ecosystem by <a href=\"https:\/\/www.defensenews.com\/congress\/2023\/06\/12\/lockheed-teams-with-new-york-chipmaker-to-onshore-production\/\" target=\"_blank\">investing in foundries <\/a>and supporting U.S. research in areas that are \u201crelatively understood,\u201d DARPA\u2019s niche is in tackling longer term technology challenges.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u201cTrying to develop the kinds of capabilities that lead to disruption, I think in the long run will keep U.S. manufacturing capabilities ahead of our competitors,\u201d Rosker said. \u201cI think our friends at other agencies . . . agree with us that this is complementary to what they\u2019re doing.\u201d<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Driven by the growing urgency within the U.S. around addressing microelectronics supply chain vulnerabilities, Congress last summer approved the $52 billion <a href=\"https:\/\/www.defensenews.com\/congress\/2022\/07\/26\/after-years-of-inattention-congress-scrambles-to-save-defense-supply-chain\/\" target=\"_blank\">Creating Helpful Incentives to Produce Semiconductors, or CHIPS Act<\/a>. The measure, which runs through 2026, funds semiconductor workforce improvement efforts, research and development and manufacturing. It also provides a 25% tax credit for investments in domestic manufacturing facilities and equipment.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">According to an Aug. 9 White House fact sheet, companies have announced more than $166 billion in semiconductor and electronics manufacturing investment <a href=\"https:\/\/www.whitehouse.gov\/briefing-room\/statements-releases\/2023\/08\/09\/fact-sheet-one-year-after-the-chips-and-science-act-biden-harris-administration-marks-historic-progress-in-bringing-semiconductor-supply-chains-home-supporting-innovation-and-protecting-national-s\/\" target=\"_blank\">in the year since the CHIPS Act passed<\/a>. The Commerce Department has established the National Semiconductor Technology Center, meant to serve as an innovation center for semiconductor technology. And the Defense Department, which received $2 billion in CHIPS Act funding, is on the verge of <a href=\"https:\/\/www.c4isrnet.com\/battlefield-tech\/2022\/02\/25\/pentagon-wants-to-bolster-domestic-microelectronics-base-with-new-innovation-network\/\" target=\"_blank\">choosing regional hubs for its Microelectronics Commons<\/a> \u2014 a network designed to create pathways to commercialize microelectronics research and innovation.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">While DARPA didn\u2019t receive CHIPS Act funding, Carl McCants, special assistant to the DARPA director for ERI, said the congressional and presidential interest has deepened the agency\u2019s engagement with DoD\u2019s microelectronics initiatives, the National Semiconductor Technology Center and industry \u2014 all partnerships that benefit the organization\u2019s work.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u201cIt leads to more discussions, it leads to more collaborations,\u201d he told C4ISRNET in an Aug. 22 interview.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Electronics Resurgence Initiative<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">That collaboration, McCants said, is a big part of ERI and its successor ERI 2.0, which aim to tackle technological hurdles that affect both the national security community and the broader commercial industry.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">ERI\u2019s original focus was on six challenges it expected the U.S. would face in the next decade. They included efforts to leverage AI hardware to reduce the time it takes sensors to process information, improve manufacturing technology and boost security.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Those focus areas birthed at least 50 DARPA programs through which the agencies developed partnerships with universities, commercial companies and the traditional defense industrial base. According to McCants, many of these organizations had never worked with DARPA.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u201cIt expanded our research, expanded our footprint, expanded, really, the access to a different set of subject matter experts that can help us do what we needed to do and what we\u2019re trying to do,\u201d he said.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">One of the ERI programs that has had the biggest impact, according to Rosker, is an effort called Photonics in the <a href=\"https:\/\/www.darpa.mil\/news-events\/2018-11-01a\" target=\"_blank\">Package for Extreme Scalability, or PIPES<\/a>. The effort uses light to improve electrical data movement between individual chips and boost performance.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Commercial companies like Intel and Xilinx as well as major defense firms like Lockheed Martin, Northrop Grumman, Raytheon and BAE systems have been working with research teams from the University of Pennsylvania, Sandia National Laboratories and other institutions on PIPES. Rosker said the effort is already changing the way those companies think about building microelectronics.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Another ERI effort, <a href=\"https:\/\/www.darpa.mil\/program\/automatic-implementation-of-secure-silicon\" target=\"_blank\">Automatic Implementation of Secure Silicon<\/a>, aims to design a mechanism for automating the process for building security into a chip\u2019s design. Rosker explained that chip designers are constantly making performance and material trades as they consider how and whether to make a product more secure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">This program, he said, not only brings automation to that process, but it would allow designers to \u201cmake those trades in a real way, in a verifiable way.\u201d<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">ERI 2.0 builds on the initiative\u2019s original research thrusts but adds two more focused on novel manufacturing techniques and developing electronics that can survive in extreme heat or cold.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The centerpiece of ERI 2.0 is an effort called <a href=\"https:\/\/sam.gov\/opp\/970df9fbaa8548668566af4a2481ddff\/view\" target=\"_blank\">Next-Generation Microelectronics Manufacturing, or NGMM<\/a>. The program aims to create a U.S.-based center for fabricating what are called 3D heterogeneously integrated microsystems.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">At a basic level, the premise of 3DHI research is that by integrating and packaging chip components differently, manufacturers could disaggregate functions like memory and processing to significantly improve performance. It\u2019s a technology area that could not only transform the U.S. industrial base, but that other nations, including Taiwan, have a strong interest in.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In July, <a href=\"https:\/\/www.darpa.mil\/news-updates\/2023-07-20\" target=\"_blank\">DARPA chose 11 industry teams<\/a> to begin the foundational work to establish the future domestic 3DHI hub. McCants expects to release an industry notice for the next two phases of the program by the end of this year and to have the center established by 2029.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">He called that timeline \u201cgeneric,\u201d adding that he\u2019s hopeful DARPA can move faster.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u201cAs with any DARPA program, things could be sped up or things could be slowed down,\u201d McCants said. \u201cThere\u2019s a timeline and a time sensitivity to being able to pull this together and move forward.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The Pentagon\u2019s hub for high-risk, high-reward research wants to help the U.S. make the next big microelectronics manufacturing breakthrough.<\/p>\n","protected":false},"author":7,"featured_media":112892,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_yoast_wpseo_meta-robots-noindex":"","_yoast_wpseo_meta-robots-nofollow":"","_yoast_wpseo_canonical":"","_acf":"","_yoast_wpseo_primary_category":19,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","_smg_distribution_targets":[]},"categories":[160,33,36,19],"tags":[],"coauthors":[3468],"class_list":["post-50639","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-daily-news-roundup","category-home","category-newsletters","category-pentagon"],"acf":{"subheadline":"","legacy_arc_id":"GVAEYZENXZF5XBNLXR2BQKSONM","arc_canonical_url":"\/battlefield-tech\/2023\/09\/08\/how-darpa-is-tackling-long-term-microelectronics-challenges\/","remove_feature_photo":false,"is_sponsored":false,"subtype":"","redirect_url":"","disable_inline_ads":false,"native_logo_pretext":"Presented 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